DS822R Transmission-type Area Static Eliminator_Room Ionization System_Static Elimination_Products

Product Details

Long-distance Ion Transport Capacity

Equipped with optimized DC ionization technology and a high-efficiency airflow design, the DS822R transmission-type Ionizer enables stable, long-distance ion transmission through pipelines, effectively covering hard-to-reach areas on production lines. Whether for the deep interior of equipment or high-altitude process chambers, uniform and rapid electrostatic neutralization is achieved. This feature is particularly suited for processes such as semiconductor wafer process and panel assembly, thoroughly resolving the issue of insufficient performance with traditional static eliminators caused by installation location constraints. It serves as a highly efficient and reliable electrostatic elimination solution.

DC ionization technology ensures stable operation

Utilizes advanced DC ionization technology, the DS822R transmission-type electrostatic eliminator produces an ion field with higher ion balance and lower residual voltage compared to traditional AC ionization methods. It operates stably and generates minimal electromagnetic interference.When integrated with long-pipeline conveyance, this technology minimizes ion loss, maintains a stable ion output concentration, and ensures that the equipment can deliver sustained, high-efficiency electrostatic neutralization over long distances even in harsh environments such as semiconductor and panel manufacturing during continuous operation.

Single Crystal Silicon ion needle, reduce contamination risk

DS822R transmission-type electrostatic eliminator adopts high-purity single crystal silicon ion needle, which produce minimal particles during ionization and resist surface contamination. This design effectively prevents electrostatic elimination defects caused by ion needle contamination at the source. This is particularly crucial for critical cleanroom processes in semiconductor manufacturing, such as Photolithography and etching. It significantly reduces product rejection rates and effectively improves overall yield, making it a reliable choice to ensure stable operation of precision processes.

24VDC input intelligent real-time monitoring and alarm ensures consistent production yield

The DS822R transmission-type Ionizer features a 24VDC wide-range power input, which is compatible with mainstream industrial power supply standards and ensures stable and reliable power supply. The device integrates an intelligent real-time monitoring and alarm system for continuous operational status tracking. It not only enables local status visualization via multi-color indicator lights but also supports remote monitoring and data feedback through communication interfaces (e.g., RS485/MODBUS).

Die Bonding Process: Eliminate Placement Contamination and Misalignment

In high-speed, high-precision die bonders, static electricity can attract airborne micro-particles to contaminate the chip bonding surface; worse still, it may cause position misalignment or cracking of ultra-thin chips during pickup. The DS822R Transmission-type Ionizer can deliver clean ionized airflow directly to enclosed, hard-to-reach key locations such as dispensing nozzles or placement heads via flexible pipelines. It instantly neutralizes static electricity on chips, substrates and suction nozzles, fundamentally reducing contamination and placement defects caused by electrostatic adsorption.

Long-distance Ion Transport Capacity

DC ionization technology ensures stable operation

Utilizes advanced DC ionization technology, the DS822R transmission-type electrostatic eliminator produces an ion field with higher ion balance and lower residual voltage compared to traditional AC ionization methods. It operates stably and generates minimal electromagnetic interference. When integrated with long-pipeline conveyance, this technology minimizes ion loss, maintains a stable ion output concentration, and ensures that the equipment can deliver sustained, high-efficiency electrostatic neutralization over long distances even in harsh environments such as semiconductor and panel manufacturing during continuous operation.