With the popularity of 5G technology and the proliferation of Internet of Things devices, communication products are constantly developing in the direction of higher frequency, high speed and high integration. In this process, electrostatic discharge (ESD) has become an important threat to product quality and reliability. Especially in new processes and high-speed circuit applications, the robustness of the charged device model (CDM) of integrated circuits continues to decline. The robustness of the 200V CDM required by the current ESD standard is facing challenges. Some pins are even lower than 5V, which is far beyond the existing protection capability range and puts forward extremely high requirements for electrostatic control in the whole industry chain.

In response to these 1 common challenges, the "second electrostatic protection technology seminar for communication products" was held today. With the theme of "focusing on electrostatic challenges and escorting communication quality", the conference brought together hundreds of experts and engineers in the fields of chip design, manufacturing, terminal equipment and testing to discuss ESD protection solutions from multiple dimensions such as cutting-edge design, standard interpretation and test verification, and is committed to building a more solid defense line for the quality of China's communication products.

Technological progress comes from sharing and cooperation. The successful holding of this seminar has injected new vitality into the progress of electrostatic protection technology in the communication industry, and will further promote the collaborative innovation of the upstream and downstream of the industrial chain, and jointly contribute to the core competitiveness of "made in China" communication products.